HZSS's commitment to the development and production of micro-channel heat exchangers

    Printed Circuit Heat Exchanger (PCHE) is a new type of high-efficiency, high-temperature, high-pressure-resistant compact heat exchanger in the fields of ultra-high temperature gas-cooled reactors, solar thermal power, and floating LNG plants. have a broad vision of application.

    PCHE: The weldment is closely attached and held at a certain temperature and pressure for a period of time, so that the atoms between the contact surfaces are mutually diffused to form a connection. The main factors affecting the diffusion bonding process and joint quality are temperature pressure diffusion time and surface roughness. The higher the soldering temperature, the faster the atom diffusion, and the soldering temperature is generally 0.5 to 0.8 times the melting point of the material. Vacuum diffusion bonding is the most widely used. Diffusion connection pressure is small, the workpiece does not produce macroscopic plastic deformation, and the strength and performance of the joint for diffusion welding are the same as those of the base material.

    Application: aerospace, aviation, petrochemical, solar thermal power, nuclear power, hydrogen energy, and marine engineering

    PCHE has excellent heat transfer performance, high heat exchange efficiency, high heat exchange capacity per unit volume, small size and light weight, and safe and reliable operation.

    HZSS is committed to the development and production of PCHE and micro-pass heat exchangers to provide our customers with an absolutely superior heat exchange solution.