Printed Circuit Heat Exchanger (PCHE)PCHE , a new type of heat exchanger with high compactness, can perform heat transfer under severe conditions such as high temperature and high pressure. Using chemical etching technology, it can etch PCHE heat exchange unit channels on the order of micrometers to millimeters. |  |
Diffusion bonding process
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Shape & structure
 Etched Plates |  PCHE |  SS-0050WT-B-P |
 PCHE |  PCHE |  Diffusion Bonded Compact HE |
Integrated micro-channel heat exchanger – features
Highly compact：5000m ²/m³ High heat transfer coefficient：3000-5000/(m ²·K) | Small channel size：0.1-2mm High pressure：30-250MPa Temperature resistance：-200℃-900℃ |
High reliability Anti-corrosion Small size and long service life |  |
Welding strength is equal to the base metal No excess, no solder clogging | Aviation, aerospace shipbuilding nuclear industry solar thermal power generation petrochemical power generation hydrogen energy and other fields |
Application
| For its excellent heat exchange performance and adaptability, HZSS micro-channel heat exchanger is widely used for: |
| 1.Transportation |
| 2.Water purifier |
| 3.Aerospace |
| 4.Marine AC |
| 5.Electronic appliances |
| 6.Energy (nuclear energy) |
| 7.Miniature cold water machine |
| 8.Chemicals/pharmaceuticals |
